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Part III: Chips & Packages

CEC Semester Two 2012
July 25, 2012 - 2:00pm EDT

In this session, we discover different types of ICs, including analog, digital, mixed-signal, and radio frequency (RF). We will also introduce the concepts of microprocessors (MPUs), microcontrollers (MCUs), programmable devices (SPLDs, CPLDs, and FPGAs), and ASICs/ASSPs/SoCs. Different forms of memory (SRAM, DRAM, EEPROM, Flash, FRAM, MRAM, and PCM) will be introduced. Also discussed will be different forms of packaging, including System-in-Package (SiP) assemblies and 3D IC technologies.

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