Vote for the Engineer of the Year

Choose from the five finalists and cast your vote for the 2017 DesignCon Engineer of the Year.

It’s time to cast your vote for the DesignCon Engineer of the Year. This award Award is given out each year during the DesignCon event and seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level, with a special emphasis on signal integrity and power integrity.

The editors of Design News and the staff of DesignCon would like to offer hearty congratulations to the nominees. For this year’s award, the winner will be able to direct a $10,000 donation to any secondary institution in the United States. Details on each nominee that follow are provided in their published biographies and by the person/s who made the nomination. Please click through all pages to see the five finalists then cast your vote by following this link.

Voting closes January 9th at 11:45 PM Eastern Time. The winner will be announced at DesignCon 2017 , January 31-February 2, at the Santa Clara Convention Center, Santa Clara, CA. 

Cast your vote for the 2017 Engineer of the Year

See the Official Rules of the Engineer of the Year Award

Please click here to learn more about DesignCon and register to attend

 

Heidi Barnes
Senior Applications Engineer, Keysight Technologies
Heidi Barnes is a Senior Application Engineer for High Speed Digital applications in the EEsof EDA Group of Keysight Technologies. Her recent activities include the application of electromagnetic, transient, and channel simulators to solve the challenges of high speed SERDES and parallel bus communication links. Heidi’s past experience includes 6 years in signal integrity for ATE test fixtures for Verigy, an Advantest Group, 6 years in RF/Microwave microcircuit packaging for Agilent Technologies, and 10 years with NASA in the aerospace industry.

Heidi exemplifies the clever engineer who continuously solves problems in the signal integrity and power integrity field for Fortune 500 companies. Her thoughtful ideas are logical and technically sound and she works extremely well with others. Her humble attitude is a pleasure to be around and this is uncommon for someone who is so brilliant. High speed digital measurements and models are an everyday task for her and she routinely designs complex serial channels with advanced tools.

Heidi serves on the DesignCon Technical Program Committee and leads conference planning as a co-chairperson for Track 13. This year at DesignCon, she is presenting at the tutorial, “ 32 to 56 Gbps Serial Link Analysis and Optimization Methods for Pathological Channels ” and participating in the panel, “ Briefing from the IEEE P370 Working Group: Electrical characterization of PCBs and related interconnects at frequencies up to 50 GHz .” Heidi is also presenting in the technical session “ Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces Using the Beatty Standard ” and sponsored session “ Signal Integrity & Power Integrity Engineering Design Techniques .” Heidi’s consistent dedication to signal integrity methodology, including serial link analysis and power delivery, along with involvement in IEEE test fixture P370, her can-do attitude, and energetic involvement in DesignCon has gained her an impressive seven nominations for this 2017 EoY award.

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